SC16C554DBIB64,151
vs
XR16V554IV
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
EXAR CORP
Part Package Code
QFP
QFP
Package Description
10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64
10 X 10 MM, 1.40 MM HEIGHT, LQFP-64
Pin Count
64
64
Manufacturer Package Code
SOT314-2
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Additional Feature
ALSO OPERATES AT 2.5V AND 5V SUPPLY
ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width
3
3
Boundary Scan
NO
NO
Clock Frequency-Max
80 MHz
64 MHz
Communication Protocol
ASYNC, BIT; SYNC, BYTE; EXT SYNC
MIL STD 1553A; MIL STD 1553B
Data Transfer Rate-Max
0.625 MBps
0.5 MBps
External Data Bus Width
8
8
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e3
Length
10 mm
10 mm
Low Power Mode
NO
NO
Moisture Sensitivity Level
1
1
Number of Serial I/Os
4
4
Number of Terminals
64
64
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Equivalence Code
QFP64,.47SQ,20
QFP64,.47SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Max
3.63 V
3.63 V
Supply Voltage-Min
2.97 V
2.97 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
1
1
Pbfree Code
No
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