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SC16C554DBIA68,529 vs SC16C554BIB80 feature comparison

SC16C554DBIA68,529 NXP Semiconductors

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SC16C554BIB80 Philips Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code LCC
Package Description PLASTIC, MS-018, SOT-188-2, LCC-68
Pin Count 68
Manufacturer Package Code SOT188-2
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 2.5V AND 5V SUPPLY
Address Bus Width 5
Boundary Scan NO
Clock Frequency-Max 80 MHz
Communication Protocol ASYNC, BIT
Data Transfer Rate-Max 0.625 MBps
External Data Bus Width 8
JESD-30 Code S-PQCC-J68 S-PQFP-G80
JESD-609 Code e3 e0
Length 24.23 mm
Low Power Mode NO
Moisture Sensitivity Level 3
Number of Serial I/Os 4
Number of Terminals 68 80
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QFP
Package Equivalence Code LDCC68,1.0SQ QFP80,.55SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm
Supply Voltage-Max 3.63 V
Supply Voltage-Min 2.97 V
Supply Voltage-Nom 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 24.23 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 2
Microcontrollers and Processors » Serial IO/Communication Controllers
Microcontrollers and Processors » Serial IO/Communication Controllers

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