SC16C554DBIA68,529 vs ST16C554DIJ68-F feature comparison

SC16C554DBIA68,529 NXP Semiconductors

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ST16C554DIJ68-F Exar Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS EXAR CORP
Part Package Code LCC LCC
Package Description PLASTIC, MS-018, SOT-188-2, LCC-68 GREEN, PLASTIC, LCC-68
Pin Count 68 68
Manufacturer Package Code SOT188-2
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP EXAR
Additional Feature ALSO OPERATES AT 2.5V AND 5V SUPPLY ALSO OPERATES AT 2.97 V MINIMUM SUPPLY
Address Bus Width 5 3
Boundary Scan NO NO
Clock Frequency-Max 80 MHz 24 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Transfer Rate-Max 0.625 MBps 0.1875 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J68 S-PQCC-J68
JESD-609 Code e3 e3
Length 24.23 mm 24.23 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3 1
Number of Serial I/Os 4 4
Number of Terminals 68 68
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC68,1.0SQ LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 5.08 mm
Supply Voltage-Max 3.63 V 5.5 V
Supply Voltage-Min 2.97 V 4.5 V
Supply Voltage-Nom 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 24.23 mm 24.23 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 2
Pbfree Code Yes
Data Encoding/Decoding Method NRZ

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