SBR6040E3
vs
USD545E3
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Package Description |
DO-5, 1 PIN
|
HERMETIC SEALED, METAL, DO-5, 1 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
REVERSE ENERGY TESTED
|
LEAKAGE CURRENT IS NOT AT 25 DEG C
|
| Application |
GENERAL PURPOSE
|
EFFICIENCY
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.6 V
|
0.68 V
|
| JEDEC-95 Code |
DO-203AB
|
DO-203AB
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| Non-rep Pk Forward Current-Max |
1000 A
|
1000 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
150 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Output Current-Max |
60 A
|
75 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Rep Pk Reverse Voltage-Max |
40 V
|
|
| Reverse Current-Max |
2000 µA
|
20000 µA
|
| Surface Mount |
NO
|
NO
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare SBR6040E3 with alternatives
Compare USD545E3 with alternatives