SB80L188EC13
vs
KU80386SX16
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
INTEL CORP
Part Package Code
QFP
QFP
Package Description
SHRINK, QFP-100
BQFP,
Pin Count
100
100
Reach Compliance Code
unknown
unknown
Address Bus Width
20
24
Bit Size
16
32
Boundary Scan
NO
NO
Clock Frequency-Max
26 MHz
32 MHz
External Data Bus Width
8
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
JESD-609 Code
e0
Length
14 mm
19.05 mm
Low Power Mode
YES
NO
Moisture Sensitivity Level
NOT SPECIFIED
Number of Terminals
100
100
Operating Temperature-Max
70 °C
100 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
BQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, BUMPER
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.66 mm
4.57 mm
Speed
13 MHz
16 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.7 V
4.5 V
Supply Voltage-Nom
3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.635 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
19.05 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
1
Additional Feature
CONTROL ROM; BARREL SHIFTER
Number of DMA Channels
Number of External Interrupts
2
Number of Serial I/Os
On Chip Data RAM Width
RAM (words)
0
Supply Current-Max
220 mA
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