SB80L188EB16
vs
TS80C186EB20
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
SHRINK, QFP-80
|
QFP,
|
| Pin Count |
80
|
80
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
|
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
|
| Address Bus Width |
20
|
20
|
| Bit Size |
16
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
32 MHz
|
40 MHz
|
| External Data Bus Width |
8
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQFP-G80
|
R-PQFP-G80
|
| Length |
12 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
80
|
80
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
QFP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
1.7 mm
|
3.15 mm
|
| Speed |
16 MHz
|
20 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
4.5 V
|
| Supply Voltage-Nom |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
12 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
|
|
|
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