SB80L188EB16
vs
HD64180RFJ-6
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Contact Manufacturer
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
RENESAS ELECTRONICS CORP
Part Package Code
QFP
QFP
Package Description
SHRINK, QFP-80
PLASTIC, FP-80
Pin Count
80
80
Reach Compliance Code
unknown
compliant
Additional Feature
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
Address Bus Width
20
20
Bit Size
16
8
Boundary Scan
NO
NO
Clock Frequency-Max
32 MHz
12.34 MHz
External Data Bus Width
8
8
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-PQFP-G80
R-PQFP-G80
Length
12 mm
20 mm
Low Power Mode
YES
YES
Number of Terminals
80
80
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFP
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.7 mm
2.9 mm
Speed
16 MHz
6.17 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
3 V
4.5 V
Supply Voltage-Nom
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
12 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
2
HTS Code
8542.31.00.01
JESD-609 Code
e0
Terminal Finish
TIN LEAD
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