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SA606DK/02,118 vs SA606DK,112 feature comparison

SA606DK/02,118 NXP Semiconductors

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SA606DK,112 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 6.5 mm 6.5 mm
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 1
Rohs Code No
Part Package Code SSOP2
Pin Count 20
Manufacturer Package Code SOT266-1
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 40
Telecommunication Circuits » Other Telecom ICs
Telecommunication Circuits » Other Telecom ICs

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