Findchips: Compare SA606DK/02,118 vs SA607DK/01,118

SA606DK/02,118 vs SA607DK/01,118 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Package Description	4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20	LSSOP,
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	R-PDSO-G20	R-PDSO-G20
Length	6.5 mm	6.5 mm
Number of Functions	1	1
Number of Terminals	20	20
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LSSOP	LSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Seated Height-Max	1.5 mm	1.5 mm
Supply Voltage-Nom	3 V	3 V
Surface Mount	YES	YES
Telecom IC Type	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	4.4 mm	4.4 mm
Base Number Matches	1	1
Rohs Code		Yes
Part Package Code		SSOP2
Pin Count		20
Manufacturer Package Code		SOT266-1
JESD-609 Code		e4
Moisture Sensitivity Level		1
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Qualification Status		Not Qualified
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Telecommunication Circuits » Other Telecom ICs	Telecommunication Circuits » Other Telecom ICs