SA606DK,112
vs
SA616DK-T
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
SSOP2
|
|
| Pin Count |
20
|
|
| Manufacturer Package Code |
SOT266-1
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| Length |
6.5 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.5 mm
|
|
| Supply Voltage-Nom |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
4.4 mm
|
|
| Base Number Matches |
1
|
2
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
TSSOP20,.25
|
| Supply Current-Max |
|
5 mA
|
| Technology |
|
BIPOLAR
|
| Terminal Finish |
|
Tin/Lead (Sn85Pb15)
|
|
|
|
Compare SA606DK,112 with alternatives
-
SA606DK,112 vs 935051650118
-
SA606DK,112 vs SA607DK/01,118
-
SA606DK,112 vs SA606DK/01,112
-
SA606DK,112 vs SA606DK/03
-
SA606DK,112 vs SA606DK-T
-
SA606DK,112 vs SA616DK,112
-
SA606DK,112 vs SA616DK,118
-
SA606DK,112 vs SA616DK/01,112
-
SA606DK,112 vs SA616DK/01,118