SA58640DK,112 vs SA58640DK feature comparison

SA58640DK,112 NXP Semiconductors

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SA58640DK NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP2 SSOP
Package Description LSSOP, LSSOP,
Pin Count 20 20
Manufacturer Package Code SOT266-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4 e4
Length 6.5 mm 6.5 mm
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Current-Max 6 mA 6 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type CORDLESS TELEPHONE SUPPORT CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 4.4 mm 4.4 mm
Base Number Matches 1 3
Pbfree Code Yes

Compare SA58640DK,112 with alternatives

Compare SA58640DK with alternatives