SA556F
vs
LM556J-MIL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SIGNETICS CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
,
DIP, DIP14,.3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-CDIP-T14
R-GDIP-T14
Number of Terminals
14
14
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Rohs Code
Samacsys Manufacturer
Texas Instruments
Analog IC - Other Type
PULSE; RECTANGULAR
JESD-609 Code
e0
Length
19.43 mm
Moisture Sensitivity Level
1
Number of Functions
2
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Code
DIP
Package Equivalence Code
DIP14,.3
Peak Reflow Temperature (Cel)
260
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
16 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Technology
BIPOLAR
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn63Pb37)
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
7.62 mm
Compare SA556F with alternatives
Compare LM556J-MIL with alternatives