S9S08SH4E2CPJ
vs
MC9S08SH4CTJ
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
DIP
|
TSSOP
|
Package Description |
DIP, DIP20,.3
|
TSSOP-20
|
Pin Count |
20
|
20
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
16 MHz
|
40 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDIP-T20
|
R-PDSO-G20
|
Length |
24.69 mm
|
6.5 mm
|
Number of I/O Lines |
18
|
17
|
Number of Terminals |
20
|
20
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
TSSOP
|
Package Equivalence Code |
DIP20,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
|
RAM (bytes) |
256
|
|
ROM (words) |
4096
|
|
ROM Programmability |
FLASH
|
FLASH
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
5.08 mm
|
1.2 mm
|
Speed |
16 MHz
|
40 MHz
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
2.7 V
|
|
Supply Voltage-Nom |
3 V
|
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
4.4 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
3
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare S9S08SH4E2CPJ with alternatives
Compare MC9S08SH4CTJ with alternatives