MC9S08SH4CTJ vs MC9S08SH4CPJ feature comparison

MC9S08SH4CTJ Rochester Electronics LLC

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MC9S08SH4CPJ NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code TSSOP
Package Description TSSOP-20 PLASTIC, DIP-20
Pin Count 20
Reach Compliance Code unknown compliant
Has ADC YES YES
Bit Size 8 8
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
JESD-30 Code R-PDSO-G20 R-PDIP-T20
JESD-609 Code e3 e3
Length 6.5 mm 24.69 mm
Moisture Sensitivity Level 3
Number of I/O Lines 17 17
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
ROM Programmability FLASH FLASH
Seated Height-Max 1.2 mm 5.08 mm
Speed 40 MHz 40 MHz
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN Tin (Sn)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 4.4 mm 7.62 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 2
ECCN Code EAR99
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width
External Data Bus Width
On Chip Program ROM Width 8
Package Equivalence Code DIP20,.3
Qualification Status Not Qualified
RAM (bytes) 256
ROM (words) 4096
Supply Voltage-Max 5.5 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V

Compare MC9S08SH4CTJ with alternatives

Compare MC9S08SH4CPJ with alternatives