S80C188EC13 vs SB80L186EC13 feature comparison

S80C188EC13 Intel Corporation

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SB80L186EC13 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code QFP QFP
Package Description QFP, QFP100,.7X.9,32 LFQFP, QFP100,.63SQ,20
Pin Count 100 100
Reach Compliance Code compliant unknown
Address Bus Width 20 20
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 26 MHz 26 MHz
External Data Bus Width 8 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-PQFP-G100 S-PQFP-G100
Length 20 mm 14 mm
Low Power Mode YES YES
Number of Terminals 100 100
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LFQFP
Package Equivalence Code QFP100,.7X.9,32 QFP100,.63SQ,20
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Power Supplies 5 V 3/5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.15 mm 1.66 mm
Speed 13 MHz 13 MHz
Supply Current-Max 70 mA 36 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 2.7 V
Supply Voltage-Nom 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 4 3
Rohs Code No
Factory Lead Time 4 Weeks
Samacsys Manufacturer Intel
JESD-609 Code e0
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare S80C188EC13 with alternatives

Compare SB80L186EC13 with alternatives