S72XS256RE0AHBJH0
vs
S72XS256RE0AHBHH0
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
SPANSION INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133
|
8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133
|
| Pin Count |
133
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.1.A
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.71
|
| JESD-30 Code |
S-PBGA-B133
|
S-PBGA-B133
|
| Length |
8 mm
|
8 mm
|
| Memory Density |
268435456 bit
|
268435456 bit
|
| Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
| Memory Width |
16
|
16
|
| Mixed Memory Type |
FLASH+SDRAM
|
FLASH+SDRAM
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
133
|
133
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
16MX16
|
16MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA133,14X14,20
|
BGA133,14X14,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
1.95 V
|
1.95 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
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