Findchips: Compare S72XS256RE0AHBHH0 vs S72XS256RE0AHBJ10

S72XS256RE0AHBHH0 vs S72XS256RE0AHBJ10 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	CYPRESS SEMICONDUCTOR CORP	CYPRESS SEMICONDUCTOR CORP
Package Description	8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133	8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133
Reach Compliance Code	compliant	compliant
ECCN Code	EAR99	EAR99
HTS Code	8542.32.00.71	8542.32.00.71
JESD-30 Code	S-PBGA-B133	S-PBGA-B133
Length	8 mm	8 mm
Memory Density	268435456 bit	268435456 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT
Memory Width	16	16
Mixed Memory Type	FLASH+SDRAM	FLASH+SDRAM
Number of Functions	1	1
Number of Terminals	133	133
Number of Words	16777216 words	16777216 words
Number of Words Code	16000000	16000000
Operating Mode	SYNCHRONOUS	SYNCHRONOUS
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-25 °C
Organization	16MX16	16MX16
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	VFBGA	VFBGA
Package Equivalence Code	BGA133,14X14,20	BGA133,14X14,20
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1 mm	1 mm
Supply Voltage-Max (Vsup)	1.95 V	1.95 V
Supply Voltage-Min (Vsup)	1.7 V	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	OTHER
Terminal Form	BALL	BALL
Terminal Pitch	0.5 mm	0.5 mm
Terminal Position	BOTTOM	BOTTOM
Width	8 mm	8 mm
Base Number Matches	2	2
	Memory » Other Memory ICs	Memory » Other Memory ICs