S71PL129JB0BFI9U0
vs
S71PL129JB0BFW9B0
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SPANSION INC
Reach Compliance Code
compliant
unknown
Base Number Matches
3
2
Rohs Code
Part Package Code
BGA
Package Description
8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64
Pin Count
64
ECCN Code
EAR99
HTS Code
8542.32.00.71
Additional Feature
PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16
JESD-30 Code
R-PBGA-B64
JESD-609 Code
e1
Length
11.6 mm
Memory Density
134217728 bit
Memory IC Type
MEMORY CIRCUIT
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
64
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-25 °C
Organization
8MX16
Package Body Material
PLASTIC/EPOXY
Package Code
TFBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.1 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
8 mm
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