S71PL129JB0BFW9B0
vs
S71PL127JA0BFW972
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
CYPRESS SEMICONDUCTOR CORP
Package Description
FBGA, BGA64,10X12,32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Mixed Memory Type
FLASH+PSRAM
FLASH+PSRAM
Number of Terminals
64
64
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-25 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Equivalence Code
BGA64,10X12,32
BGA64,10X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.07 mA
0.07 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
2
3
Power Supplies
3 V
Supply Voltage-Nom (Vsup)
3 V