S71GL064A08BAW0B3 vs SST34HF3284-70-4E-L1P feature comparison

S71GL064A08BAW0B3 Spansion

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SST34HF3284-70-4E-L1P Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SPANSION INC MICROCHIP TECHNOLOGY INC
Part Package Code BGA BGA
Package Description TFBGA, 8 X 10 MM, 1.40 MM HEIGHT, MO-210, LFBGA-56
Pin Count 56 56
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature SRAM IS ORGANIZED AS 512K X 16 ALSO CONTAINS 512K X 16 SRAM
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e0
Length 9 mm 10 mm
Memory Density 67108864 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 4194304 words 2097152 words
Number of Words Code 4000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -20 °C
Organization 4MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.1 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 7 mm 8 mm
Base Number Matches 1 2
Pbfree Code No
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 10

Compare S71GL064A08BAW0B3 with alternatives

Compare SST34HF3284-70-4E-L1P with alternatives