SST34HF3284-70-4E-L1P
vs
S71PL032JF0BFI073
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SPANSION INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
8 X 10 MM, 1.40 MM HEIGHT, MO-210, LFBGA-56
|
TFBGA,
|
| Pin Count |
56
|
56
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Additional Feature |
ALSO CONTAINS 512K X 16 SRAM
|
PSRAM IS ORGANIZED AS 1M X 16
|
| JESD-30 Code |
R-PBGA-B56
|
R-PBGA-B56
|
| Length |
10 mm
|
9 mm
|
| Memory Density |
33554432 bit
|
33554432 bit
|
| Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
56
|
56
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Organization |
2MX16
|
2MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.3 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Width |
8 mm
|
7 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare SST34HF3284-70-4E-L1P with alternatives
Compare S71PL032JF0BFI073 with alternatives