S54LS10F883B vs SN74LS10DRG4 feature comparison

S54LS10F883B NXP Semiconductors

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SN74LS10DRG4 Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer SIGNETICS CORP ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description DIP, DIP14,.3 GREEN, PLASTIC, MS-012AB, SOIC-14
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supply Current-Max (ICC) 3.3 mA
Prop. Delay@Nom-Sup 15 ns
Propagation Delay (tpd) 15 ns 15 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Screening Level MIL-STD-883 Class B
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Length 8.65 mm
Seated Height-Max 1.75 mm
Width 3.9 mm

Compare S54LS10F883B with alternatives

Compare SN74LS10DRG4 with alternatives