S54H08F883C vs 5962G9651801Q9A feature comparison

S54H08F883C Philips Semiconductors

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5962G9651801Q9A Cobham PLC

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SIGNETICS CORP COBHAM PLC
Package Description DIP, DIP14,.3 DIE,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family TTL/H/L AC
JESD-30 Code R-GDIP-T14 R-XUUC-N14
JESD-609 Code e0
Logic IC Type AND GATE AND GATE
Max I(ol) 0.02 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP14,.3 DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Power Supply Current-Max (ICC) 64 mA
Prop. Delay@Nom-Sup 12 ns
Propagation Delay (tpd) 12 ns 13 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Screening Level MIL-STD-883 MIL-PRF-38535 Class Q
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Base Number Matches 2 1
Total Dose 1M Rad(Si) V

Compare S54H08F883C with alternatives

Compare 5962G9651801Q9A with alternatives