S34ML04G100BHV013
vs
S34ML04G100BHI003
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
End Of Life
Ihs Manufacturer
SKYHIGH MEMORY LTD
SKYHIGH MEMORY LTD
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
25 ns
25 ns
Command User Interface
YES
YES
Data Polling
NO
NO
Data Retention Time-Min
10
10
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
Length
11 mm
11 mm
Memory Density
4294967296 bit
4294967296 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Sectors/Size
4K
4K
Number of Terminals
63
63
Number of Words
536870912 words
536870912 words
Number of Words Code
512000000
512000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512MX8
512MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA63,10X12,32
BGA63,10X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size
2K words
2K words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3.3 V
3.3 V
Ready/Busy
YES
YES
Seated Height-Max
1 mm
1 mm
Sector Size
128K
128K
Standby Current-Max
0.00005 A
0.00005 A
Supply Current-Max
0.03 mA
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
YES
Type
SLC NAND TYPE
SLC NAND TYPE
Width
9 mm
9 mm
Write Cycle Time-Max (tWC)
0.000025 ms
0.000025 ms
Base Number Matches
3
3
Rohs Code
Package Description
BGA-63
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
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