S34ML04G100BHI003
vs
S34ML04G100BHV000
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
End Of Life
|
Transferred
|
Ihs Manufacturer |
SKYHIGH MEMORY LTD
|
SPANSION INC
|
Package Description |
BGA-63
|
11 X 9 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
3A991.B.1.A
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
25 ns
|
|
Command User Interface |
YES
|
YES
|
Data Polling |
NO
|
NO
|
Data Retention Time-Min |
10
|
10
|
JESD-30 Code |
R-PBGA-B63
|
R-PBGA-B63
|
JESD-609 Code |
e1
|
|
Length |
11 mm
|
11 mm
|
Memory Density |
4294967296 bit
|
4294967296 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
4K
|
|
Number of Terminals |
63
|
63
|
Number of Words |
536870912 words
|
536870912 words
|
Number of Words Code |
512000000
|
512000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
512MX8
|
512MX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA63,10X12,32
|
BGA64,10X12,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Page Size |
2K words
|
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
3.3 V
|
3.3 V
|
Ready/Busy |
YES
|
|
Seated Height-Max |
1 mm
|
1 mm
|
Sector Size |
128K
|
|
Standby Current-Max |
0.00005 A
|
0.00001 A
|
Supply Current-Max |
0.03 mA
|
0.035 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Toggle Bit |
YES
|
|
Type |
SLC NAND TYPE
|
SLC NAND TYPE
|
Width |
9 mm
|
9 mm
|
Write Cycle Time-Max (tWC) |
0.000025 ms
|
|
Base Number Matches |
3
|
3
|
Common Flash Interface |
|
NO
|
|
|
|
Compare S34ML04G100BHI003 with alternatives