S29PL32J55BFI12
vs
S29PL032J55BFI120
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
SPANSION INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
BGA
|
|
| Package Description |
VFBGA,
|
|
| Pin Count |
48
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
55 ns
|
|
| Boot Block |
BOTTOM/TOP
|
|
| JESD-30 Code |
R-PBGA-B48
|
|
| Length |
8.15 mm
|
|
| Memory Density |
33554432 bit
|
|
| Memory IC Type |
FLASH
|
|
| Memory Width |
16
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
48
|
|
| Number of Words |
2097152 words
|
|
| Number of Words Code |
2000000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
2MX16
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VFBGA
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
|
| Parallel/Serial |
PARALLEL
|
|
| Programming Voltage |
3 V
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Type |
NOR TYPE
|
|
| Width |
6.15 mm
|
|
| Base Number Matches |
2
|
3
|
|
|
|
Compare S29PL32J55BFI12 with alternatives