S29NS01GSABWHW000 vs S29WS01GS0SWHW000 feature comparison

S29NS01GSABWHW000 Spansion

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S29WS01GS0SWHW000 Cypress Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description 11.00 X 13.00 MM, 0.65 MM PITCH, LEAD AND HALOGEN FREE, FBGA-186 11.00 X 13.00 MM, 0.65 MM PITCH, LEAD AND HALOGEN FREE, FBGA-186
Pin Count 186
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 115 ns 115 ns
Additional Feature SYNCHRONOUS BURST ACCESS ALSO POSSIBLE SYNCHRONOUS BURST ACCESS ALSO POSSIBLE
Boot Block BOTTOM/TOP BOTTOM/TOP
JESD-30 Code R-PBGA-B186 R-PBGA-B186
Length 13 mm 13 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 186 186
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 64MX16 64MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 11 mm 11 mm
Base Number Matches 1 1
Rohs Code Yes

Compare S29NS01GSABWHW000 with alternatives

Compare S29WS01GS0SWHW000 with alternatives