S29NS01GSABWHW000
vs
S29WS01GSAAWHW000
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SPANSION INC
|
| Reach Compliance Code |
compliant
|
unknown
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
BGA
|
| Package Description |
|
11.00 X 13.00 MM, 0.65 MM PITCH, LEAD AND HALOGEN FREE, FBGA-186
|
| Pin Count |
|
186
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| Access Time-Max |
|
115 ns
|
| Additional Feature |
|
SYNCHRONOUS BURST ACCESS ALSO POSSIBLE
|
| Boot Block |
|
BOTTOM/TOP
|
| JESD-30 Code |
|
R-PBGA-B186
|
| Length |
|
13 mm
|
| Memory Density |
|
1073741824 bit
|
| Memory IC Type |
|
FLASH
|
| Memory Width |
|
16
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
186
|
| Number of Words |
|
67108864 words
|
| Number of Words Code |
|
64000000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Organization |
|
64MX16
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TFBGA
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
|
PARALLEL
|
| Programming Voltage |
|
1.8 V
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
|
1.95 V
|
| Supply Voltage-Min (Vsup) |
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
OTHER
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
BOTTOM
|
| Type |
|
NOR TYPE
|
| Width |
|
11 mm
|
|
|
|
Compare S29WS01GSAAWHW000 with alternatives