S29GL512P13FAIV22 vs S29GL256N11FFIIH2 feature comparison

S29GL512P13FAIV22 Cypress Semiconductor

Buy Now Datasheet

S29GL256N11FFIIH2 Spansion

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SPANSION INC
Package Description LBGA, 10 X 13 MM, 1 MM PITCH, LEAD FREE, FBGA-64
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 110 ns 110 ns
Alternate Memory Width 8 8
JESD-30 Code R-PBGA-B64 R-PBGA-B64
JESD-609 Code e0
Length 13 mm 13 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 33554432 words 16777216 words
Number of Words Code 32000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32MX16 16MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 11 mm 10 mm
Base Number Matches 2 1
Part Package Code BGA
Pin Count 64
Output Characteristics 3-STATE

Compare S29GL512P13FAIV22 with alternatives

Compare S29GL256N11FFIIH2 with alternatives