S29GL256N11FFIIH2 vs S29GL512N11FFIV23 feature comparison

S29GL256N11FFIIH2 Spansion

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S29GL512N11FFIV23 AMD

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description 10 X 13 MM, 1 MM PITCH, LEAD FREE, FBGA-64 BGA, BGA64,8X8,40
Pin Count 64
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 110 ns 110 ns
Alternate Memory Width 8 8
JESD-30 Code R-PBGA-B64 S-PBGA-B64
Length 13 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1
Number of Terminals 64 64
Number of Words 16777216 words 33554432 words
Number of Words Code 16000000 32000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX16 32MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA BGA
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 10 mm
Base Number Matches 1 3
Rohs Code Yes
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 512
Package Equivalence Code BGA64,8X8,40
Page Size 8/16 words
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.000005 A
Supply Current-Max 0.09 mA
Toggle Bit YES

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