S29GL064N90FFA022
vs
M29W640GB60ZS6F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
MICRON TECHNOLOGY INC
Package Description
LBGA,
LBGA, BGA64,8X8,40
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Date Of Intro
2017-05-26
Access Time-Max
90 ns
60 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM/TOP
BOTTOM
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
Length
13 mm
13 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Screening Level
AEC-Q100
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
11 mm
11 mm
Base Number Matches
1
2
Rohs Code
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
Number of Sectors/Size
8,127
Package Equivalence Code
BGA64,8X8,40
Page Size
4/8 words
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Ready/Busy
YES
Sector Size
8K,64K
Standby Current-Max
0.0001 A
Supply Current-Max
0.02 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Toggle Bit
YES
Compare S29GL064N90FFA022 with alternatives
Compare M29W640GB60ZS6F with alternatives