S29GL064N90BFI33 vs M28W640CB80ZB1T feature comparison

S29GL064N90BFI33 Spansion

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M28W640CB80ZB1T STMicroelectronics

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SPANSION INC STMICROELECTRONICS
Part Package Code BGA BGA
Package Description 8.15 X 6.15 MM, LEAD FREE, FBGA-48 TFBGA,
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 80 ns
Alternate Memory Width 8
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1
Length 8.15 mm 10.5 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 6.15 mm 6.39 mm
Base Number Matches 1 1
Additional Feature BOTTOM BOOT BLOCK
Boot Block BOTTOM
Type NOR TYPE

Compare S29GL064N90BFI33 with alternatives

Compare M28W640CB80ZB1T with alternatives