S29CL032J0PFAM03 vs S29CL016J0JQFM122 feature comparison

S29CL032J0PFAM03 Spansion

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S29CL016J0JQFM122 Spansion

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA QFP
Package Description LBGA, QFP,
Pin Count 80 80
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 54 ns 54 ns
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block BOTTOM TOP
Clock Frequency-Max (fCLK) 66 MHz
JESD-30 Code R-PBGA-B80 R-PQFP-G80
Length 13 mm 20 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 80 80
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX32 512KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA QFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3.3 V 3.3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 3.35 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM QUAD
Width 11 mm 14 mm
Write Cycle Time-Max (tWC) 0.000065 ms
Base Number Matches 4 1
Pbfree Code Yes
JESD-609 Code e3
Moisture Sensitivity Level 3
Terminal Finish MATTE TIN
Type NOR TYPE

Compare S29CL032J0PFAM03 with alternatives

Compare S29CL016J0JQFM122 with alternatives