S29CD016J0JFAN122 vs S29CD016G0PFAN003 feature comparison

S29CD016J0JFAN122 Spansion

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S29CD016G0PFAN003 AMD

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description 13 X 11 MM, 1 MM PITCH, FBGA-80 ,
Pin Count 80
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 54 ns
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 Code R-PBGA-B80
JESD-609 Code e0
Length 13 mm
Memory Density 16777216 bit
Memory IC Type FLASH
Memory Width 32
Number of Functions 1
Number of Terminals 80
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Organization 512KX32
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Programming Voltage 2.7 V
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Supply Current-Max 0.09 mA
Supply Voltage-Max (Vsup) 2.75 V
Supply Voltage-Min (Vsup) 2.5 V
Supply Voltage-Nom (Vsup) 2.6 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Type NOR TYPE
Width 11 mm
Base Number Matches 1 2
Boot Block TOP

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