S25VB60
vs
GBU10K-BP
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
SHINDENGEN ELECTRIC MANUFACTURING CO LTD
|
MICRO COMMERCIAL COMPONENTS
|
Package Description |
S-XUFM-D4
|
R-PSFM-T4
|
Pin Count |
4
|
4
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
HIGH RELIABILITY
|
|
Case Connection |
ISOLATED
|
|
Configuration |
BRIDGE, 4 ELEMENTS
|
BRIDGE, 4 ELEMENTS
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
BRIDGE RECTIFIER DIODE
|
BRIDGE RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1 V
|
1 V
|
JESD-30 Code |
S-XUFM-D4
|
R-PSFM-T4
|
Non-rep Pk Forward Current-Max |
400 A
|
200 A
|
Number of Elements |
4
|
4
|
Number of Phases |
1
|
1
|
Number of Terminals |
4
|
4
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Output Current-Max |
6 A
|
10 A
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
600 V
|
800 V
|
Surface Mount |
NO
|
NO
|
Terminal Form |
SOLDER LUG
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
SINGLE
|
Base Number Matches |
5
|
1
|
Pbfree Code |
|
Yes
|
Samacsys Manufacturer |
|
MCC
|
Breakdown Voltage-Min |
|
800 V
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Reference Standard |
|
UL RECOGNIZED
|
Reverse Current-Max |
|
5 µA
|
Terminal Finish |
|
Matte Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare S25VB60 with alternatives
Compare GBU10K-BP with alternatives