S25FL008A0LNFI003 vs W25Q80DVUXAE feature comparison

S25FL008A0LNFI003 AMD

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W25Q80DVUXAE Winbond Electronics Corp

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC WINBOND ELECTRONICS CORP
Package Description SON, SOLCC8,.25 USON-8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 50 MHz 66 MHz
Data Retention Time-Min 20 20
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-N8 R-PDSO-N8
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Terminals 8 8
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SON HVSON
Package Equivalence Code SOLCC8,.25 SOLCC8,.12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified
Serial Bus Type SPI QSPI
Standby Current-Max 0.00001 A 0.00006 A
Supply Current-Max 0.024 mA 0.025 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 2 1
Length 3 mm
Number of Functions 1
Operating Mode SYNCHRONOUS
Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V
Screening Level AEC-Q100
Seated Height-Max 0.6 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 2 mm

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