S0302CPG1152F30
vs
S0302CPX1152F30-W
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STATE OF THE ART INC
|
STATE OF THE ART INC
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e4
|
e0
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Height |
0.38 mm
|
0.38 mm
|
| Package Length |
0.81 mm
|
0.81 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.56 mm
|
0.56 mm
|
| Packing Method |
Bulk
|
WAFFLE PACK
|
| Rated Power Dissipation (P) |
0.04 W
|
0.04 W
|
| Resistance |
11500 Ω
|
11500 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0302
|
0302
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
300 ppm/°C
|
300 ppm/°C
|
| Terminal Finish |
Gold (Au)
|
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
15 V
|
15 V
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Package Description |
|
CHIP
|
| HTS Code |
|
8533.21.00.30
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare S0302CPG1152F30 with alternatives
Compare S0302CPX1152F30-W with alternatives