S0302CPG1152F30
vs
S0302CPX1152F30
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
Construction
Chip
Chip
JESD-609 Code
e4
e0
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Height
0.38 mm
0.38 mm
Package Length
0.81 mm
0.81 mm
Package Style
SMT
SMT
Package Width
0.56 mm
0.56 mm
Packing Method
Bulk
BULK
Rated Power Dissipation (P)
0.04 W
0.04 W
Resistance
11500 Ω
11500 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0302
0302
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
300 ppm/°C
300 ppm/°C
Terminal Finish
Gold (Au)
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Tolerance
1%
1%
Working Voltage
15 V
15 V
Base Number Matches
1
1
Pbfree Code
No
Package Description
CHIP
HTS Code
8533.21.00.30
Mounting Feature
SURFACE MOUNT
Package Shape
RECTANGULAR PACKAGE
Rated Temperature
70 °C
Surface Mount
YES
Terminal Shape
WRAPAROUND
Compare S0302CPG1152F30 with alternatives
Compare S0302CPX1152F30 with alternatives