RTSX72SU-1CQ256EV
vs
RTSX72SU-1CQ256B
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFP
|
|
| Package Description |
HGQFF, TPAK256,3SQ,20
|
CERAMIC, QFP-256
|
| Pin Count |
256
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
72000 TYPICAL GATES AVAILABLE
|
72000 TYPICAL GATES AVAILABLE
|
| Clock Frequency-Max |
310 MHz
|
310 MHz
|
| Combinatorial Delay of a CLB-Max |
1.2 ns
|
1.2 ns
|
| JESD-30 Code |
S-CQFP-F256
|
S-CQFP-F256
|
| Length |
36 mm
|
36 mm
|
| Number of CLBs |
6036
|
6036
|
| Number of Equivalent Gates |
108000
|
108000
|
| Number of Inputs |
212
|
360
|
| Number of Logic Cells |
6036
|
6036
|
| Number of Outputs |
212
|
360
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
6036 CLBS, 108000 GATES
|
6036 CLBS, 108000 GATES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
HGQFF
|
HGQFF
|
| Package Equivalence Code |
TPAK256,3SQ,20
|
TPAK256,3SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, GUARD RING
|
FLATPACK, HEAT SINK/SLUG, GUARD RING
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class V
|
MIL-STD-883 Class B
|
| Seated Height-Max |
3.3 mm
|
3.3 mm
|
| Supply Voltage-Max |
2.75 V
|
2.75 V
|
| Supply Voltage-Min |
2.25 V
|
2.25 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Total Dose |
100k Rad(Si) V
|
100k Rad(Si) V
|
| Width |
36 mm
|
36 mm
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
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