RP73PG2B78R7BTDF
vs
RP73G2B78R7ATDG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TE CONNECTIVITY LTD
TE CONNECTIVITY LTD
Package Description
CHIP
CHIP
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Construction
Rectangular
Chip
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
3.05 mm
3.05 mm
Package Style
SMT
SMT
Package Width
1.55 mm
1.55 mm
Packing Method
TR, PAPER, 7 INCH
TR, PAPER, 7 INCH
Rated Power Dissipation (P)
0.33 W
0.25 W
Rated Temperature
70 °C
70 °C
Resistance
78.7 Ω
78.7 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
50 ppm/°C
50 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.1%
0.05%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Rohs Code
Additional Feature
HIGH PRECISION
Manufacturer Series
RP73
Package Shape
RECTANGULAR PACKAGE
Reference Standard
MIL-STD-202
Series
RP73
Compare RP73PG2B78R7BTDF with alternatives
Compare RP73G2B78R7ATDG with alternatives