RP73G2B27KDTDF vs RP73G2B27KDTG feature comparison

RP73G2B27KDTDF TE Connectivity

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RP73G2B27KDTG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TE CONNECTIVITY LTD TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code unknown unknown
Construction Rectangular Rectangular
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.05 mm 3.05 mm
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method TR, PAPER, 7 INCH TR
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Resistance 27000 Ω 27000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 50 ppm/°C 50 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 200 V 200 V
Base Number Matches 1 1

Compare RP73G2B27KDTDF with alternatives

Compare RP73G2B27KDTG with alternatives