RP73F2H200KDTE
vs
RNCF2010DTE200K
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TE CONNECTIVITY LTD
STACKPOLE ELECTRONICS INC
Package Description
CHIP
CHIP
Reach Compliance Code
unknown
compliant
Construction
Rectangular
Rectangular
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
4.9 mm
4.9 mm
Package Style
SMT
SMT
Package Width
2.4 mm
2.4 mm
Packing Method
TR, EMBOSSED PLASTIC, 7 INCH
TR, Embossed Plastic, 7 Inch
Rated Power Dissipation (P)
0.33 W
0.33 W
Rated Temperature
70 °C
70 °C
Resistance
200000 Ω
200000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
25 ppm/°C
25 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.5%
0.5%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Pbfree Code
ECCN Code
EAR99
HTS Code
8533.21.00.30
Factory Lead Time
14 Weeks
Samacsys Manufacturer
Stackpole Electronics, Inc.
Additional Feature
PRECISION
Package Shape
RECTANGULAR PACKAGE
Reference Standard
AEC-Q200
Compare RP73F2H200KDTE with alternatives
Compare RNCF2010DTE200K with alternatives