RN142SMT2R
vs
BAP65-05WT/R
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROHM CO LTD
|
NXP SEMICONDUCTORS
|
| Package Description |
SC-79, SOD-523, 2 PIN
|
R-PDSO-G3
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Factory Lead Time |
17 Weeks
|
|
| Date Of Intro |
2018-08-09
|
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
|
| Additional Feature |
HIGH RELIABILITY
|
|
| Application |
SWITCHING
|
ATTENUATOR; SWITCHING
|
| Breakdown Voltage-Min |
60 V
|
30 V
|
| Configuration |
SINGLE
|
COMMON CATHODE, 2 ELEMENTS
|
| Diode Capacitance-Max |
0.45 pF
|
0.9 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
2 Ω
|
0.9 Ω
|
| Diode Res Test Current |
10 mA
|
|
| Diode Res Test Frequency |
100 MHz
|
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
VERY HIGH FREQUENCY
|
|
| JESD-30 Code |
R-PDSO-F2
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
e3
|
| Number of Elements |
1
|
2
|
| Number of Terminals |
2
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Reverse Test Voltage |
1 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SC-70
|
| Pin Count |
|
3
|
| Minority Carrier Lifetime-Nom |
|
0.17 µs
|
| Operating Temperature-Min |
|
-65 °C
|
| Power Dissipation-Max |
|
0.24 W
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare RN142SMT2R with alternatives
Compare BAP65-05WT/R with alternatives