RM54AC174SFA
vs
M38510R75307BFX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
DFP,
DFP,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
AC
JESD-30 Code
R-GDFP-F16
R-XDFP-F16
JESD-609 Code
e0
Length
9.6645 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
1
Number of Bits
1
1
Number of Functions
6
6
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
DFP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
13 ns
14 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.032 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
3 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
6.604 mm
fmax-Min
90 MHz
95 MHz
Base Number Matches
1
1
Package Equivalence Code
FL16,.3
Screening Level
MIL-M-38510 Class B
Total Dose
100k Rad(Si) V
Compare RM54AC174SFA with alternatives
Compare M38510R75307BFX with alternatives