RM25J364BP
vs
BCR1364JE
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CAL-CHIP ELECTRONICS INC
|
TT ELECTRONICS PLC
|
Package Description |
CHIP
|
CHIP
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8533.21.00.30
|
|
Construction |
Glass Coat
|
Thick Film
|
JESD-609 Code |
e3
|
e0
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
0.55 mm
|
0.6 mm
|
Package Length |
6.3 mm
|
6.3 mm
|
Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
Package Style |
SMT
|
SMT
|
Package Width |
0.5 mm
|
3.2 mm
|
Packing Method |
BULK
|
TR, EMBOSSED
|
Rated Power Dissipation (P) |
1 W
|
1 W
|
Rated Temperature |
70 °C
|
70 °C
|
Resistance |
360000 Ω
|
360000 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Size Code |
2512
|
2512
|
Surface Mount |
YES
|
YES
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
Tin/Lead (Sn/Pb)
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Tolerance |
5%
|
5%
|
Working Voltage |
200 V
|
200 V
|
Base Number Matches |
1
|
2
|
Manufacturer Series |
|
BCR
|
Series |
|
BCR
|
|
|
|
Compare RM25J364BP with alternatives
Compare BCR1364JE with alternatives