RM12J332CTDK
vs
SG73P2BLBK332J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CAL-CHIP ELECTRONICS INC
KOA SPEER ELECTRONICS INC
Package Description
CHIP
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Construction
Rectangular
Chip
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.6 mm
Package Length
3.1 mm
3.2 mm
Package Style
SMT
SMT
Package Width
1.55 mm
1.6 mm
Packing Method
TR, PAPER, 7 INCH
Bulk
Rated Power Dissipation (P)
0.25 W
0.33 W
Rated Temperature
70 °C
Resistance
3300 Ω
3300 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
200 V
200 V
Base Number Matches
1
2
Rohs Code
No
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Compare RM12J332CTDK with alternatives
Compare SG73P2BLBK332J with alternatives