RM12F33R2CTDK vs MC1206-33R2-FBW feature comparison

RM12F33R2CTDK Cal-Chip Electronics

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MC1206-33R2-FBW RCD Components Inc

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer CAL-CHIP ELECTRONICS INC RCD COMPONENTS INC
Package Description CHIP CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Rectangular Rectangular
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.61 mm
Package Length 3.1 mm 3.2 mm
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method TR, PAPER, 7 INCH Bulk
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Resistance 33.2 Ω 33.2 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish TIN OVER NICKEL Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 3 1
Pbfree Code Yes
Rohs Code Yes

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