RLS628-01TT vs HLS628-01TG feature comparison

RLS628-01TT Advanced Interconnections Corp

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HLS628-01TG Advanced Interconnections Corp

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ADVANCED INTERCONNECTIONS CORP ADVANCED INTERCONNECTIONS CORP
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8536.69.40.40 8536.69.40.40
Contact Finish Mating NOT SPECIFIED GOLD OVER NICKEL
Contact Finish Termination Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact Material NOT SPECIFIED BERYLLIUM COPPER/COPPER ALLOY
Device Socket Type IC SOCKET IC SOCKET
Device Type Used On DIP28 DIP28
Housing Material LIQUID CRYSTAL POLYMER POLYETHYLENE
JESD-609 Code e0 e0
Number of Contacts 28 28
Base Number Matches 1 1
Additional Feature STANDARD: UL 94V-0, LOW PROFILE
Body Breadth 0.7 inch
Body Depth 0.165 inch
Body Length 1.4 inch
Contact Configuration RECTANGLE
Contact Style RND PIN-SKT
Mating Contact Pitch 0.1 inch
Mounting Style STRAIGHT
Operating Temperature-Max 260 °C
Operating Temperature-Min -60 °C
PCB Contact Pattern RECTANGULAR
PCB Contact Row Spacing 0.6000000000000001 mm
Terminal Pitch 2.54 mm
Termination Type SOLDER

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