RLS328-29MG
vs
HLS328-29GG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ADVANCED INTERCONNECTIONS CORP
ADVANCED INTERCONNECTIONS CORP
Package Description
ROHS COMPLIANT
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8536.69.40.40
8536.69.40.40
Additional Feature
LOW PROFILE
STANDARD: UL 94V-0, LOW PROFILE
Contact Finish Mating
GOLD OVER NICKEL
NOT SPECIFIED
Contact Finish Termination
Matte Tin (Sn) - with Nickel (Ni) barrier
GOLD OVER NICKEL
Contact Material
BERYLLIUM COPPER/COPPER ALLOY
NOT SPECIFIED
Device Socket Type
IC SOCKET
IC SOCKET
Device Type Used On
DIP28
DIP28
Housing Material
LIQUID CRYSTAL POLYMER
POLYETHYLENE
JESD-609 Code
e3
e4
Number of Contacts
28
28
Base Number Matches
1
1
Body Breadth
0.7 inch
Body Depth
0.165 inch
Body Length
1.4 inch
Contact Configuration
RECTANGLE
Contact Style
RND PIN-SKT
Mating Contact Pitch
0.1 inch
Mounting Style
STRAIGHT
Operating Temperature-Max
260 °C
Operating Temperature-Min
-60 °C
PCB Contact Pattern
RECTANGULAR
PCB Contact Row Spacing
0.30000000000000004 mm
Terminal Pitch
2.54 mm
Termination Type
SOLDER
Compare RLS328-29MG with alternatives
Compare HLS328-29GG with alternatives