RF2364
vs
BGA2012,115
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RF MICRO DEVICES INC
|
NXP SEMICONDUCTORS
|
| Package Description |
TSOP5/6,.11,37
|
TSSOP6,.08
|
| Reach Compliance Code |
unknown
|
compliant
|
| Characteristic Impedance |
50 Ω
|
50 Ω
|
| Construction |
COMPONENT
|
COMPONENT
|
| Gain |
18 dB
|
14 dB
|
| Input Power-Max (CW) |
10 dBm
|
|
| JESD-609 Code |
e0
|
e3
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
6
|
| Operating Frequency-Max |
1990 MHz
|
|
| Operating Frequency-Min |
1930 MHz
|
|
| Operating Temperature-Max |
85 °C
|
150 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
TSSOP6,.08
|
| Power Supplies |
3 V
|
3 V
|
| RF/Microwave Device Type |
NARROW BAND MEDIUM POWER
|
NARROW BAND LOW POWER
|
| Supply Current-Max |
23.5 mA
|
10 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin (Sn)
|
| VSWR-Max |
2
|
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
6
|
| Manufacturer Package Code |
|
SOT363
|
| HTS Code |
|
8542.33.00.01
|
|
|
|
Compare RF2364 with alternatives
Compare BGA2012,115 with alternatives